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CONTENTS: From the Editor | Measuring Temperature of Dynamic Scenes | Product Feature | Focus on Applications | Electrophysics Partners with Snell | See Us! | Gallery | Other Links | Contact Us |
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focus on applications
Lexar Recalls Overheating Jump Drives... Phillips
is having trouble with 12,000 of its plasma TVs, and the company has
agreed to repair them because
of an overheating problem... Olympus
Recalls Film Cameras for Overheating, Poses Burn Hazard... Fujitsu
Siemens Recalls Overheating Notebook Batteries... The proliferation of electronic gadgets over the past few years has been breathtaking. Whether in an MP3 player, computer or cell phone, a printed circuit board (PCB) provides the logic, power management and functionality we have come to expect. As devices get smaller, yet more powerful, the density of electronics creates tough challenges to today's designers.
Large printed circuit board under power cycling test Designers are increasingly turning to thermal imaging to analyze and validate designs. Today's infrared cameras are accurate, easy to use, can resolve objects as small as 5µm, and are very cost effective. Traditionally, temperature measurement has been performed using thermocouples or other contact measurement sensors, while computer-based design tools are available that simulate thermal maps of products based on component selection, placement and proximity. Contact measurement techniques are labor intensive and often act as heat sinks, degrading the quality of the measurements (this is particularly true when measuring small pitch parts). While PC tools are very useful during the initial design phases, there is no substitute for real-time measurements made of real hardware running over the range of environmental conditions anticipated. |
Electrophysics
Partners With Snell Infrared
for R&D Training
Introduction | Greg's Tip | Course and Agenda | Register
In the thermal imaging world, whether the application is product development, target signature, non-destructive testing, quality control or something more exotic, obtaining the optimal results requires that the thermal imaging equipment and associated software must be properly matched with the application. However, hardware and software are only part of the equation. A huge part of success in any application is the knowledge and training that the operator has achieved. Without proper training most users of thermal imaging systems will not get the most out of their equipment and therefore the results.
Electrophysics has partnered with Snell Infrared to be our supplier of thermal imaging for Research, Development, and Testing applications. Snell Infrared is a world leader in the training and certification of thermographers with over 20 years of experience. The folks at Snell have organized a training course that specializes in the demanding needs of our R&D customers. We invite you to learn more about this exciting training program.
Now, the experts at Electrophysics can work with our clients to assure that they are using the proper hardware and software to meet their application needs. Snell Infrared can provide professional training to insure that the user can unlock the intricacies of the equipment and the applications. It is a Win/Win/Win situation!
Here, Instructor Greg McIntosh gives us his insight into the benefits of R&D training for thermal imaging users.
Greg McIntosh's Tip on Thinking Thermally® for R&D
When utilizing thermography in new and unique situations there are two fundamental types of analysis which can be performed: Qualitative — analyzing temperature patterns; and Quantitative — analyzing radiant surface temperatures. Qualitative thermography often indicates the physical source and extent of the heat transfer while quantitative thermography may show the root cause is and severity.
The power of thermography is that pattern methodologies can be developed, which allow identification of real versus apparent problems. This however is only possible if a systemic methodology is followed and adequate thermal detail is presented. In terms of instrument operation, this means that range, focus, level and span all must be optimized to "paint" as much thermal detail as possible on the object of interest to enable adequate pattern recognition. Once that is done there are various techniques that may be employed to analyze the image.
Qualitative analysis techniques include: Identify a characteristic heat transfer signature; Identify a characteristic equipment signature; Compare with like operating equipment; Examining the thermal contrast within the image; Identifying the response to a changing environment; or Identifying the response to a changing internal temperature. Qualitative analysis requires that good camera techniques be employed to ensure the thermal pattern is "real" rather than indicative of surface material or thermal surroundings.
Quantitative techniques include: using spot measurements, area statistics, isotherms, histograms, line profiling, or time-temperature plotting. Quantitative techniques require sound radiometric parameter measurement and correction including allowances for surface emissivity, background temperature, environmental parameters, and instrument limitations.
Utilizing Infrared Imaging for Research, Development and
Testing |
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This 4-day, 32-hour course provides an excellent opportunity to learn and explore all of the issues related to using infrared thermography for solving new and unique research, design, development and test applications. An extensive variety of topics will be covered including:
Who should attend?
There is no prerequisite for this course. Cameras and software will be available for use if you do not yet own thermal imaging equipment. |
Who is the Instructor?
Drawing on his diversified background in engineering, thermal imaging, automation and training he has helped many companies successfully implement their infrared programs in research, product development and testing. He has written training manuals and published practical guides and papers on applied thermography, including a chapter in the handbook, The Theory and Practice of Radiation Thermometry. He has sat on numerous technical and standard committees and was chairman of SPIE ThermoSense XI in 1989.
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Greg
McIntosh is a registered professional engineer specializing in heat
transfer and thermodynamics. He has decades
of practical experience in
the thermal Infrared imaging industry working for private industry,
consulting, government and IR manufacturers. He started the first North
American
Infrared Training Center for AGA Infrared Systems (now FLIR Systems)
in 1979. He has trained thousands of thermographers — some of
whom are leading industrial experts and trainers in the field today.
In 1981
he helped establish the curriculum and was a principal trainer for
the Joint
Public Works Canada/GSA North American Building Training Course — the
very first certification course for infrared thermographers. After
his automation company, Viewscan Ltd., was purchased by AGEMA Infrared,
he
held positions as Technical Director for AGEMA North America, Vice
President of AGEMA Automation, and after their merger with FLIR Systems,
Product
Manager of Automation Products. 
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Come See Us! SPIE | SAE | MSS Symposia | CLEO | MIT High-Speed Program |
April 10th-12th, 2007
Orlando World Center Marriott Resort and Convention Center
Orlando, Florida
Booth 101
The SPIE Defense and Security Symposium is the must-attend event for anyone working in the security and defense industries. Don't miss this opportunity to interact face-to-face with people who are shaping your industry, both in the technical conferences and the exhibition.
For more information and to register: www.spie.org
top of article
April 16th–19th, 2007
Cobo Center, Detroit, Michigan
Booth 2215
This conference offers the world's largest and most respected technical program on advanced automotive technologies.
Theme: Engineering for Global Sustainable Mobility—It's Up to Us
For four days, the SAE 2007 World Congress exists as a rare microcosm of the global automotive industry—where the novice and the veteran will find what is necessary for enhancing core knowledge, while also gaining invaluable exposure to the people and the dialogue that will shape our industry, and in many ways, the world in which we live.
For more information and to register: www.sae.org
top of article
Military Sensing Symposia (MSS)
April 24th–26th, 2007
Orlando, Florida
This is a DOD-sponsored classified forum that focuses on the latest in Infrared Countermeasures. Key presentations will include updates on the Foreign Threat and an Overview of the DHS Efforts in Commercial Aircraft protection.
For more information and to register: www.sensiac.gatech.edu/external/index.jsf
top of article
May 8th–10th, 2007
Baltimore Convention Center
Baltimore, Maryland
The 26th annual Conference on Lasers and Electro-Optics (CLEO 2007) is dedicated to showcasing the science and technology behind laser and optical applications for a wide range of industries, including defense, data communications, and imaging.
For more information and to register: www.cleoconference.org
top of article
MIT High-Speed Imaging for Motion Analysis
June 18th–21st, 2007
MIT Campus
Cambridge, Massachusetts
This program is designed for scientists, engineers, and photographers who need to gather data on rapidly moving subjects and events for study, motion analysis, and trouble-shooting. Come to see the latest in high-speed-imaging equipment.
For more information and to register click here.
focus on applications
Designing
Today's Electronics to Be More Reliable
(continued)
Thermal imaging is a very practical solution for electronics testing. Today's systems offer:
- High resolution — over 300,000 points per image
- High sensitivity — as low as 15mK
- Spot sizes as small as 5µm
- Fast response — <10 microseconds
- Real time data acquisition — as fast as 20,000 images per second
Electronic boards incorporate multiple materials and components including plastic, fiberglass, silicon, silver, lead, gold and other materials. Each of these material's surfaces (and materials in general) emit energy differently based on their reflective properties. In the past, these varying emissivity properties posed challenges when attempting to make accurate temperature measurements.
Emissivity correction software has been developed to compensate for different materials found on PCBs. The concept is relatively simple, yet elegant: Thermal images are taken of the same target at two different ambient temperatures. Knowing the two ambient temperatures, the emissivity correction software can then calculate the only unknown variable: emissivity. An emissivity map is applied that essentially creates a unique emissivity for each pixel, which in turn will provide an accurate temperature measurement.
Disk drive imaging subtracted from "Gold" reference
standard. Notice the temperature scale.
Click the image to go to our Gallery Page and see the video clip.
Another software tool is image subtraction. If a thermal image is taken of a "gold standard" PCB, subsequent thermal images can be taken of boards and these images can be subtracted from the reference PCB. The resulting data will only show variations from the known good board clearly showing areas for further evaluation.
Whether the problem is a result of a defective component, improper placement, incorrectly sized components or short circuits thermal imaging system are a cost addition to any development labs test and measurement instrument pool.
Applications Gallery
Click here to visit our Gallery Page to browse our video clips and still application images.
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other links
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Electrophysics Photonics Product Line | Range Calculator |
373 Route 46, Fairfield, NJ 07004 • 973-882-0211 • www.electrophysics.com